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Semi Doped

Semi Doped

Vikram Sekar and Austin Lyons 37 Episodes Aug 18, 2026

A podcast about the business and technology of semiconductors, providing insights for engineers and investors alike.

Episodes

Tensordyne's R K Anand: HPE Juniper Fabric, Logarithmic Math, MoE Inference, Air Cooling, 3nm
Tensordyne's R K Anand: HPE Juniper Fabric, Logarithmic Math, MoE Inference, Air Cooling, 3nm Aug 18, 2026 3331 Tensordyne co-founder and CPO R K Anand joins Austin to discuss the company's strategy for disrupting AI inference. RK explains how Tensordyne combines power-efficient logarithmic math with a battle-hardened networking fabric from partner HPE Juniper. The result is a high-density, air-cooled system designed to efficiently run massive Mixture-of-Experts models in existing data centers.Key Take
NEWS TAKE: China's Optical Ban, Volta's $10B Anthropic Deal, AMD's Earnings
NEWS TAKE: China's Optical Ban, Volta's $10B Anthropic Deal, AMD's Earnings Aug 11, 2026 2093 Austin Lyons and Vik Sekar break down three stories that hit semis last week. They analyze a proposed US ban on Chinese optical transceivers that threatens to cut off 50% of the global supply, the market's reaction to AMD's surprise $800M CapEx spend despite strong earnings, and how a new company called Volta Infrastructure landed a $10B compute deal with Anthropic by pioneering a new fi
GlobalFoundries Thomas Barber: CPO, Silicon Photonics, 300mm, SiGe, OCI, NRZ
GlobalFoundries Thomas Barber: CPO, Silicon Photonics, 300mm, SiGe, OCI, NRZ Aug 7, 2026 2373 The physical limits of copper are forcing a shift to optical interconnects in AI data centers. Austin sits down with GlobalFoundries' Thomas Barber to unpack why GF thinks it can lead that transition twice over: once with its long-running silicon photonics platform, and again with the specialty Silicon Germanium process the industry needs to drive it."The enemy to me right now is copper.
How Retimers Built an $80B Company: The Story of Astera Labs
How Retimers Built an $80B Company: The Story of Astera Labs Jul 31, 2026 2864 A retimer is a small, unglamorous chip. Astera turned it into a high-margin franchise. Austin and Vik cover why copper gives up at PCIe speeds, what a retimer does that a redriver can't, and how one H100 socket became a moat. Then Scorpio: can Astera take switch share from Broadcom?Key Takeaways:- 30cm of PCB trace at Gen 5's 32 GT/s and the signal is gone. Signal integrity is an inside-
News Take: Hyperscaler CDS, SK Hynix Earnings, China's DUV
News Take: Hyperscaler CDS, SK Hynix Earnings, China's DUV Jul 29, 2026 1076 Austin Lyons and Vik Sekar break down the market's recent volatility. They discuss the rising fear around hyperscaler debt, visible in credit default swap (CDS) premiums, and the counter-argument that GPU ROI is actually understated. They then analyze the paradox of SK Hynix's massive stock drop despite record growth, and explain why China's new DUV lithography tool makes 3D chip st
Datacenter Interconnects: Copper vs. Optics, Nvidia's 78-Layer PCB, Co-Packaged Optics (CPO)
Datacenter Interconnects: Copper vs. Optics, Nvidia's 78-Layer PCB, Co-Packaged Optics (CPO) Jul 24, 2026 2951 Vik Sekar and Austin Lyons tackle the biggest bottleneck in inference: moving data. They break down the three tiers of datacenter networking — scale up, scale out, scale across — and the core engineering trade-off at each layer: copper vs. optics. Topics include Nvidia's extreme measures to keep scale-up fabric electrical (a 78-layer mid-plane PCB), why Co-Packaged Optics is the "holy gr
PicoJool's Al Yuen: The Case for GaAs VCSELs in Scale-Up Interconnects
PicoJool's Al Yuen: The Case for GaAs VCSELs in Scale-Up Interconnects Jul 16, 2026 2960 Al Yuen, CEO of PicoJool, talks with Austin about using VCSELs for scale-up optical interconnects in AI data centers. Al explains why gallium arsenide (GaAs) supply is unconstrained while indium phosphide (InP) is limited, and how PicoJool can leverage existing supply chains to ship in the millions per month. They cover the roadmap from 1.6T to 12.8T, the trade-offs among 8×200G, 16×100G, and 32×5
WEKA's Val Bercovici: KV Cache, DeepSeek V4, HBF, SLC vs QLC NAND, CXL, NVLink, Tokenomics
WEKA's Val Bercovici: KV Cache, DeepSeek V4, HBF, SLC vs QLC NAND, CXL, NVLink, Tokenomics Jul 10, 2026 3851 Vik welcomes Val Bercovici from Weka to discuss the rapidly evolving landscape of AI memory and storage. Val explains how Weka's architecture leverages high-bandwidth networks to make storage faster than motherboard DRAM. They dive into KV cache optimizations, the future of NAND flash tiers, and the role of CXL in AI inference. The episode concludes with a look at predictive memory offloading
Micron's Record Profits, Apple's CXMT Plea: AI is Eating All the Memory
Micron's Record Profits, Apple's CXMT Plea: AI is Eating All the Memory Jul 3, 2026 3055 Austin and Vik break down the current memory crisis, where AI demand is driving unprecedented profits for memory makers like Micron, while simultaneously causing inflation and price hikes for consumer electronics. They discuss how even premium brands like Apple are struggling to secure supply, leading them to controversial suppliers. The hosts also explore the long-term implications of AI's i
Qualcomm's HBC Memory, Alphawave, Modular, and more
Qualcomm's HBC Memory, Alphawave, Modular, and more Jun 29, 2026 3583 Qualcomm flew Austin to New York for its investor day, where the communications company laid out a plan to make data center, automotive, and IoT two-thirds of its business by FY29. Austin was in the room and asked Cristiano Amon a question on the record. Vik watched the whole thing on YouTube. Together they break down what actually changed.The technical centerpiece is High Bandwidth Compute (HBC):
Advanced Packaging, TSMC CoWoS, Intel EMIB
Advanced Packaging, TSMC CoWoS, Intel EMIB Jun 19, 2026 4143 New episode: Advanced packaging for AI chips, from wire bonds to TSMC CoWOS and Intel EMIB.Packaging is no longer an afterthought. It is the chip, and Intel's EMIB challenges TSMC's CoWOS.Three CoWOS flavors: silicon, organic RDL, local bridgesEMIB embeds tiny bridges into the substrate, no interposerEMIB-T and EMIB-M add through-silicon vias and power capacitorsGoogle is booking 3M TPUs
Computex Mania 2026: Optics and Power
Computex Mania 2026: Optics and Power Jun 12, 2026 2893 Austin and Vik discuss their recent experience at Computex, where they met for the first time in person after six months of podcasting together. They share insights about the massive show, the people they connected with, and the exciting developments in AI hardware and interconnect technology. Connect with Vik and Austin via a daily free newsletter:https://www.semidoped.comVik's Paid Substack

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